Winbond - Product Promotion
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Product Promotion

DateEventDescriptionLocationBooth
Oct/07/2008
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Oct/11/2008
Winbond Releases Multiple Key Chips and IC Design Technologies at 2008 Taipei Taitronics AutumnTaipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei)4F M102
Mar/03/2008
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Mar/04/2008‧Mar/10/2008
Winbond Introduces Multiple Key Chips and IC Design Technologies at 2008 IIC-ChinaShenzhen Convention and Exhibition CenterShanghai Mart Shenzhen 2J29‧Shanghai 4B10
Oct/18/2007
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Oct/21/2007
Winbond Releases Multiple Key Chips and IC Design Technologies at 2007 eMEX SuzhouSuzhou International Expo Center(Expo Plaza, Suzhou Industrial Park)4I28, 4B Hall
Sep/5/2007
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Sep/8/2007
Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007Hangzhou Peace International Exhibition & Conference CenterH13-23, G14-24
Aug/20/2007‧Aug/22/2007‧Aug/24/2007  Winbond Electronics will hold an 8/32-bit Micro-controller introduction and application seminar in Beijing, Shanghai and ShenzhenBeijing‧Shanghai‧ShenzhenJadepalace Hotel Beijing‧Holiday Inn Pudong Shanghai‧Grand View Hotel Shenzhen
Jul/26/2007
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Jul/29/2007
 Winbond to Display Multiple Key Chips and IC Design Technologies at Taitronics Bangkok 2007Bangkok International Trade & Exhibition Centre (BITEC)A2-A10, B1-B9
Jun/13/2007
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Jun/14/2007
Winbond Strikes with New Applications for Windows® SideShow™ at WinHEC 2007 TaipeiTaipei International Convention CenterNo.1
May/10/2007
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May/12/2007
Winbond will Display Multiple Key Chips and IC Design Technologies at 2007 SemiTech Taipei ExhibitionTaipei World Trade Center P823, 824, P825, 826